Student Academic Scholarships

In addition to the other competitions sponsored by TMS, student members have the opportunity to apply for a number of scholarships. Except for the International Symposium on Superalloys Scholarship, all TMS academic scholarships are available only to sophomore and junior undergraduate applicants. Additional competition opportunities can be found on the View Material Advantage web site.
Scholarship Details
J. Keith Brimacombe Presidential Scholarship
Funding By: TMS Foundation
One $5,000 cash award scholarship is made to an undergraduate student majoring in metallurgical engineering, materials science and engineering, or minerals processing/extraction programs. In addition, a travel stipend of $1,000 is available for the recipient to attend the TMS Annual Meeting, to formally receive the scholarship.
Light Metals Division Scholarship
Funding By: TMS Light Metals Division
Three $4,000 scholarships are available to full-time undergraduate applicants in their sophomore or junior years, who are majoring in metallurgical and/or materials science and engineering with an emphasis on both traditional (aluminum, magnesium, beryllium, titanium, lithium and other reactive metals) and emerging (composites, laminates, etc.) light metals. Additionally, recipients may select up to $300 worth of Light Metals Division-sponsored conference proceedings or textbooks to be donated in the recipient’s name to his/her college or university library. Each recipient may also choose up to $400 worth of books for his/her personal use. As the awards are presented during the Light Metals Division luncheon at the TMS Annual Meeting and Exhibition, up to $600 for travel expenses is available to each recipient. Scholarship recipients are known as LMD Scholars.
Materials Processing & Manufacturing Division Scholarship
Funding By: TMS Materials Processing & Manufacturing Division
Two $2,500 scholarships are awarded to undergraduate students in their sophomore or junior years, who are majoring in metallurgical and/or materials science and engineering with an emphasis on manufacturing from product design to production, integrating process control technology into manufacturing, and basic and applied research into key materials technologies that impact manufacturing processes. Additionally, each recipient receives up to $500 for travel expenses to attend the meeting to accept the award. Recipients are known as MPMD Scholars.
Structural Materials Division Scholarship
Funding By: TMS Structural Materials Division
Two $2,500 scholarships are available to full-time undergraduate applicants in their sophomore or junior years, who are majoring in metallurgical and/or materials science and engineering with an emphasis on the science and engineering of load-bearing materials, including studies into the nature of a material’s physical properties based upon its microstructure and operating environment. Awards are presented at the TMS Annual Meeting and Exhibition, and up to $500 is available for each recipient’s travel expenses. Scholarship recipients are known as SMD Scholars.
Extraction & Processing Division Scholarship
Funding By: TMS Extraction & Processing Division
Four $2,000 scholarships are available to full-time undergraduate applicants in their sophomore or junior years, who are majoring in the extraction and processing of minerals, metals and materials. Each scholarship recipient is also given the opportunity to select up to five Extraction & Processing Division-sponsored conference proceedings or textbooks to be donated in the recipient’s name to his/her college or university library. Awards are presented during the Extraction & Processing Division luncheon at the TMS Annual Meeting and Exhibition. Up to $500 for travel expenses is available to each recipient in order to accept the award at the luncheon. Scholarship recipients are known as EPD Scholars.
Electronic, Magnetic & Photonic Materials Division Gilbert Chin Scholarship
Funding By: TMS Electronic, Magnetic & Photonic Materials Division
One $2,000 scholarship is available to an undergraduate students in their sophomore and junior years, who are studying subjects in relation to synthesis and processing, structure, properties, and performance of electronic, photonic, magnetic, and superconducting materials as well as materials used in packaging, and interconnecting such materials in device structures. An additional $500 for travel expenses is available to the recipient in order to personally accept the award at the TMS Annual Meeting and Exhibition. The scholarship recipient is known as the EMPMD Gilbert Chin Scholar.
International Symposium on Superalloys Scholarship
Funding By: Organizing Committee of the International Symposium on Superalloys
Two $2,000 scholarships with up to $500 in travel reimbursements are available to undergraduate and graduate students majoring in metallurgical and/or materials science and engineering with an emphasis on all aspects of the high-temperature, high-performance materials used in the gas turbine industry and all other applications. Awards are presented in conjunction with the Materials Science and Technology Conference. This scholarship is open to undergraduate and graduate students.

Eligibility and Judging Requirements
1. The applicant must be a student member of TMS.

2. Applicants must be undergraduate sophomores or junior unless otherwise noted.

3. Applicants must be enrolled full time in a metallurgical/materials science engineering program at a qualified college or university.

4. Relatives of members of the TMS Student Affairs Committee or of the funding committee/division are not eligible.

5. Submitted coursework must be relevant to the scholarship for which the student is applying.

Judging Criteria
Scholarship recipients are chosen by specially appointed selection committees of the TMS Student Affairs Committee. The following judging criteria are employed:

• Relevance of Coursework/Experience to division's focus
• Scholarship Application
• Academic Achievement
• Activities in and out of School, Including Work Experience
• Leadership
• Personal Profile Statement
• Letters of Recommendation
How to Enter

Submission Deadline: The submission deadline is March 15th of each year.

• Applicants must submit their typed information on the Scholarship Application Form. Applications are only accepted via mail.

o Comprehensive Application Brochure with background and all forms
o Scholarship Application Form Only
o Scholarship Recommendation Form Only
• Applications for TMS scholarships are to be made by the students themselves.
• Photocopies of the official Scholarship Forms may be reproduced locally.
• In addition to information requested on the Scholarship Form, applicants must attach an individual statement of 200 words or less, typed, double-spaced, describing career plans, reports on special projects, leadership roles, work experience, and community involvement. This is an opportunity for the applicant to convey specific career plans relating to a particular area of interest.

• Evidence of academic achievement (including rank in class) is an important factor; therefore, a transcript or facsimile of recent academic record and current GPA is required.

• Applications should include three official Recommendation Forms from educators or employers.

• Applicants may apply for up to two scholarship programs. This must be indicated at the bottom of the Scholarship Application Form.
For More Information...

TMS Student Awards Program
184 Thorn Hill Road
Warrendale, PA 15086 USA
Telephone (724) 776-9000
Fax (724) 776-3770
E-mail students@tms.org